Electronics Sector Skills Council of India (ESSCI) has signed a Memorandum of Understanding (MoU) with the Uttar Pradesh Electronics Corporation Ltd (UPLC) on 8 April 2026, to establish a comprehensive framework for skilling youth in the high-growth domains of electronics and semiconductor manufacturing.
ESSCI will take the lead in designing and conducting specialized training, upskilling, and reskilling programs tailored to industry-specific and future skill requirements across Uttar Pradesh. A primary focus will be placed on advanced technical areas, including semiconductor design, fabrication, and high-tech electronics manufacturing.
UPLC will serve as the primary facilitator, leveraging its state-wide network to connect ESSCI with academic institutions, research organizations, and government bodies. The two entities will work jointly to identify workforce capability gaps and future requirements aligned with the state’s sectoral priorities. Furthermore, UPLC will assist in identifying potential locations for the development of a Centre of Excellence, intended to serve as a beacon for research and entrepreneurial ecosystems within the state.
Speaking on the partnership, Madhvendra Singh, CEO, ESSCI, said, “This MoU represents a pivotal step toward building a future-ready workforce for India’s burgeoning semiconductor mission. By combining ESSCI’s technical expertise with UPLC’s robust infrastructure in Uttar Pradesh, we are creating a roadmap that moves beyond basic assembly to high-value design and manufacturing. Our goal is to empower the youth of the state with specialized skills that meet global standards, ensuring they are not just employable, but are drivers of innovation in the ESDM sector.”
This collaboration is expected to significantly enhance the employability outcomes of local youth by providing direct industry linkages and placement support, ultimately positioning Uttar Pradesh as a premier destination for global electronics giants.
